China (Shanghai) International Electronic Packaging Test exhibition, Shanghai famous exhibition, welcome to participate in the exhibition, round you will show your dream. Online registration of exhibitors to view the exhibition overview, exhibition schedule, exhibition time, exhibition location, scope of participation, organizers, exhibitors and other details.
Today, China has become one of the world's largest electronic information products manufacturers, many of the world's famous electronic companies are transferred to China's production of a large number of first- and second-level packaging, now packaging testing, sintering skills have evolved into semiconductors, LEDs, electronics field of a pearl, is an indispensable process after the completion of integrated circuit chip production, is a device-to-system bridge. For the industry and upstream and downstream industries to provide information exchange, market development and business decision-making, product display, technology development platform for enterprises and institutions, research institutes and institutions of higher learning to build bridges. In order to better promote the electronic packaging testing industry interaction, improve the international level of the electronic packaging testing industry, "China (Shanghai) International Electronic Packaging Testing Exhibition (CIEPET-) " will be held in Shanghai New International Expo Center. CIEPET - divided into exhibitions, summit forums and academic conferences, is the electronic packaging testing industry's annual event, but also the electronic packaging testing industry and related industries exchange and cooperation of a comprehensive professional display platform.
The scope of the exhibition Electronic metal packaging, electronic ceramic packaging, electronic plastic packaging, electronic epoxy resin material packaging, packaging materials and processes, electronic packaging equipment and advanced manufacturing technology, electronic packaging testing technology equipment, electronic sintering-related products and technologies; Advanced packaging and system integration: ball grid array packaging, chip-level packaging, flip chip, wafer-level packaging, 3D integration and a variety of other advanced packaging and system integration technology; Package materials and processes: keys and wire, welding balls, solder paste, conductive glue and other interconnecting materials; Sub-chip fillers, binders, thin-film materials, dielectric materials, substrate materials, frame materials, thermal conductive materials, green electronic materials and other new materials that can high package performance and reduce costs; as well as a variety of packaging and assembly processes; Package design and simulation: a variety of new package/assembly designs, electronic packaging of electrical, thermal, optical and mechanical characteristics modeling, simulation and verification methods; Multi-scale and multiphysical modeling, etc. Emerging field packaging: sensors, actuators, micro-electromechanical systems, nano-mechanical systems, micro-optical electromechanical system packaging technology; Optoelectronic package, CMOS image sensor package; Packaging and integration technology in liquid crystal display, passive components, RF, power and high-voltage devices, and nano-devices and other emerging applications; High-density substrate and assembly technology: embedded passive and active component substrate technology; High-density interconnect substrates, printed circuit boards, high-density high-performance substrates; and other new substrate technologies that can improve the density and performance of substrates;
2025年
展會時間：待定
展會地點：待定
2026年
展會時間：待定
展會地點：待定
2027年
展會時間：待定
展會地點：待定
當今中國已成為世界**大電子信息產(chǎn)品的制造國之一，眾多世界著名電子公司的大量一級、二級封裝正在轉(zhuǎn)入我國生產(chǎn)，如今封裝測試、燒結(jié)技能已演變成半導體、LED、電子領域一顆明珠，是集成電路芯片生產(chǎn)完成后不可缺少的一道工序，是器件到系統(tǒng)的橋梁。為本行業(yè)及上下游行業(yè)提供信息交流，市場開拓和經(jīng)營決策、產(chǎn)品展示、技術(shù)開發(fā)的平臺，為企事業(yè)單位、科研院所和高等院校搭建橋梁。為更好的推動電子封裝測試業(yè)界交流互動，提升電子封裝測試行業(yè)國際化水平，“中國(上海)國際電子封裝測試展覽會（CIEPET-）”將在上海新國際博覽中心隆重召開。CIEPET- 分為展覽會、高峰論壇和學術(shù)會議三大板塊，是電子封裝測試行業(yè)的年度盛會，也是電子封裝測試行業(yè)和相關產(chǎn)業(yè)交流合作的綜合性專業(yè)展示平臺。
參展范圍
電子金屬封裝、電子陶瓷封裝、電子塑料封裝、電子環(huán)氧樹脂材料封裝、封裝材料與工藝、電子封裝設備及先進制造技術(shù)、電子封裝測試技術(shù)設備、電子燒結(jié)相關產(chǎn)品與技術(shù)等;
先進封裝與系統(tǒng)集成: 球柵陣列封裝、芯片級封裝、倒裝芯片、晶圓級封裝、三維集成及其它各種先進的封裝和系統(tǒng)集成技術(shù)等;
封裝材料與工藝: 鍵和絲、焊球、焊膏、導電膠等互連材料;芯片下填料、粘結(jié)劑、薄膜材料、介電材料、基板材料、框架材料、導熱材料、綠色電子材料以及其他能夠高封裝性能和降低成本的新型材料;以及各種各樣的封裝與組裝工藝等；
封裝設計與模擬: 各種新的封裝/組裝設計；電子封裝的電、熱、光和機械特性建模、模擬和驗證方法;多尺度和多物理量建模等;
新興領域封裝: 傳感器、執(zhí)行器、微機電系統(tǒng)、納機電系統(tǒng)、微光機電系統(tǒng)的封裝技術(shù);光電子封裝，CMOS圖像傳感器封裝;封裝及集成技術(shù)在液晶顯示，無源元件，射頻、功率和高壓器件，及納米器件等新興領域的應用等；
高密度基板及組裝技術(shù): 嵌入式無源和有源元件基板技術(shù);高密度互連基板、印刷線路板、高密度高性能基板;及其它能夠提高基板密度和性能的各種新型基板技術(shù)等；
China (Shanghai) International Electronic Packaging Test exhibition, Shanghai famous exhibition, welcome to participate in the exhibition, round you will show your dream. Online registration of exhibitors to view the exhibition overview, exhibition schedule, exhibition time, exhibition location, scope of participation, organizers, exhibitors and other details.
Today, China has become one of the world's largest electronic information products manufacturers, many of the world's famous electronic companies are transferred to China's production of a large number of first- and second-level packaging, now packaging testing, sintering skills have evolved into semiconductors, LEDs, electronics field of a pearl, is an indispensable process after the completion of integrated circuit chip production, is a device-to-system bridge. For the industry and upstream and downstream industries to provide information exchange, market development and business decision-making, product display, technology development platform for enterprises and institutions, research institutes and institutions of higher learning to build bridges. In order to better promote the electronic packaging testing industry interaction, improve the international level of the electronic packaging testing industry, "China (Shanghai) International Electronic Packaging Testing Exhibition (CIEPET-) " will be held in Shanghai New International Expo Center. CIEPET - divided into exhibitions, summit forums and academic conferences, is the electronic packaging testing industry's annual event, but also the electronic packaging testing industry and related industries exchange and cooperation of a comprehensive professional display platform.
The scope of the exhibition
Electronic metal packaging, electronic ceramic packaging, electronic plastic packaging, electronic epoxy resin material packaging, packaging materials and processes, electronic packaging equipment and advanced manufacturing technology, electronic packaging testing technology equipment, electronic sintering-related products and technologies;
Advanced packaging and system integration: ball grid array packaging, chip-level packaging, flip chip, wafer-level packaging, 3D integration and a variety of other advanced packaging and system integration technology;
Package materials and processes: keys and wire, welding balls, solder paste, conductive glue and other interconnecting materials; Sub-chip fillers, binders, thin-film materials, dielectric materials, substrate materials, frame materials, thermal conductive materials, green electronic materials and other new materials that can high package performance and reduce costs; as well as a variety of packaging and assembly processes;
Package design and simulation: a variety of new package/assembly designs, electronic packaging of electrical, thermal, optical and mechanical characteristics modeling, simulation and verification methods; Multi-scale and multiphysical modeling, etc.
Emerging field packaging: sensors, actuators, micro-electromechanical systems, nano-mechanical systems, micro-optical electromechanical system packaging technology; Optoelectronic package, CMOS image sensor package; Packaging and integration technology in liquid crystal display, passive components, RF, power and high-voltage devices, and nano-devices and other emerging applications;
High-density substrate and assembly technology: embedded passive and active component substrate technology; High-density interconnect substrates, printed circuit boards, high-density high-performance substrates; and other new substrate technologies that can improve the density and performance of substrates;