電子組裝工藝: 設(shè)計、咨詢和測試服務(wù)、合同制造服務(wù)、REACH/RoHS合規(guī)服務(wù)、CAD/CAE/CAM系統(tǒng)、元器件、連接器和緊固件、模板印刷設(shè)備、組件準(zhǔn)備及放置設(shè)備、組裝設(shè)備、點(diǎn)涂設(shè)備、回流焊設(shè)備、清潔設(shè)備、手焊工藝及相關(guān)化學(xué)品、設(shè)備、焊接相關(guān)化學(xué)品、設(shè)備、引線鍵合設(shè)備、測試、測量和檢驗(yàn)設(shè)備、返工/維修設(shè)備、鉆孔、鑼板和加工設(shè)備、其它 Sponsored by: Hong Kong Circuit Board Association (HKPCA)
Period: Annual Exhibition Area: 50,000 square exhibitors Number: 800 Number of visitors: 34,974 people
The Electronic Circuits (Shenzhen) Exhibition (2019 HKPCA Show) is dedicated to serving the rapidly growing circuit board industry worldwide. Designed for manufacturers, traders, suppliers, distributors and agents interested in purchasing the latest raw materials, production equipment and manufactured goods, this exhibition is the world's largest and most influential annual PCB flagship exhibition.
Circuit boards: connector PCBs, high-density interconnected printed circuit boards, IC-sealed loading boards (BGA/CSP/inverted wafers, etc.), rigid single-sided circuit boards, rigid two-sided and multi-sided circuit boards, hard and soft combined boards, flexible printed circuit boards, and others
Circuit board/intelligent automation equipment: circuit board CAD/CAM system, pre-production preparation process, internal and external imaging and circuit design process, laminated process, CNC mechanical drilling process, CNC high density laser drilling process, electrolyzing/chemical plating process, automated operation/robot system, form factoring, AOI/AVI/line board-related inspection process, surface treatment/post-processing process, anti-welding printing process, other
Environmental clean technology and equipment: environmentally friendly clean production technology and equipment, water treatment/recycling technology and equipment, clean room technology and equipment, waste recycling system, cleaning system/equipment, smoke control/emission system
Line board raw materials/chemicals: thin-film circuit design and related chemicals, resin system/raw laminates, fiberglass cloth/cloth/carbon fiber, copper foil, CNC mechanical drill bits, dry film/photo liquid corrosion inhibitors and other related chemicals, copper plating/tin/gold plating, electrolytic chemicals, surface-treated chemicals, silk and photosensive impedance film, ink, etc
Electronic assembly processes: design, consulting and testing services, contract manufacturing services, REACH/RoHS compliance services, CAD/CAE/CAM systems, components, connectors and fasteners, template printing equipment, component preparation and placement equipment, assembly equipment, dotting equipment, reflow welding equipment, cleaning equipment, hand welding processes and related chemicals, equipment, welding-related chemicals, equipment, lead bonding equipment, testing, measurement and inspection equipment, rework/equipment, drilling, drilling,
2025年
展會時間：待定
展會地點(diǎn)：待定
2026年
展會時間：待定
展會地點(diǎn)：待定
2027年
展會時間：待定
展會地點(diǎn)：待定